TEM investigation of Ti and Ti/Al bilayer as alternative diffusion barriers for Cu metallization for SAW device applications
M. Spindler(Leibniz Institute for Solid State and Materials Research), J. Eckert(Montanuniversität Leoben), J. Thomas(University of Calicut), Thomas Gemming(Leibniz Institute for Solid State and Materials Research), C. Eggs(Leibniz Institute for Solid State and Materials Research), S. Menzel(Leibniz Institute for Solid State and Materials Research)
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