effect of Diverse Ligands on the Course of a Molecules-to-Solids Process and Properties of Its Intermediates
M. L. Steigerwald(AT&T (United States)), S. M. Tanzler(AT&T (United States)), Theo Siegrist(Florida A&M University - Florida State University College of Engineering), E. M. Gyorgy(AT&T (United States)), Young‐Uk Kwon(Sungkyunkwan University), B. Hessen(AT&T (United States))
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