Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)

Andrew Strandjord(University of Colorado Colorado Springs), Christine Jauernig(University of Colorado Colorado Springs), Scott Popelar(University of Colorado Colorado Springs)
Microelectronics Reliability
February 1, 2002
10.1016/s0026-2714(01)00236-0
Cited by 61

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