Improvement of moisture resistance in plastic encapsulated MOS-IC by surface finishing copper leadframe

Osamu YOSHIOKA(Hitachi (Japan)), Gen Murakami(Tokyo Dental College), Ryuichi YAMAGISHI(Hitachi (Japan)), N. Okabe(Jikei University School of Medicine), S. Nagayama(Hitachi (Japan))
Proceedings., 39th Electronic Components Conference
January 13, 2003
Cited by 45


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