Simulation Study of the Grinding Process

Stephen Law(Singapore Polytechnic), S. M. Wu(University of Wisconsin–Madison)
Journal of Engineering for Industry
November 1, 1973
Cited by 43

Abstract

A model in terms of grain distributions and kinematic conditions has been recently developed [8] for a specified grinding process. Using this model, an exploratory attempt was made to study the grinding process with respect to the surface topography and nature of surface interactions by simulation on a digital computer. Fundamental grinding parameters, such as the effective grain density, grain spacings, chip depths, and chip areas, are employed to describe the grain-workpiece interactions. The grinding process is studied under a systematic variation of table speed, wheel depth of cut, and grain apex angle. The physical significance of the Z-distribution and stochastic nature of the grinding process is also discussed.


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