256 Mb DRAM technologies for file applications

G. Kitsukawa(Hitachi (Japan)), Masashi Horiguchi(Hitachi (Japan)), Y. Kawaijiri(Hitachi (Japan)), T. Kawahara(Hitachi (Japan)), T. Aikiba, Y. Kawase(Hitachi (Japan)), T. Tachibana(Hitachi (Japan)), Takeshi Sakai(Hitachi (Japan)), Masakazu Aoki(Hitachi (Japan)), S. Shukuri(Hitachi (Japan)), K. Sagara(Hitachi (Japan)), R. Nagai(Hitachi (Japan)), Norio Hasegawa(Hitachi (Japan)), N. Yokoyama(Hitachi (Japan)), T. Kisu(Hitachi (Japan)), Hiroyuki Yamashita(Hitachi (Japan)), T. Kure(Hitachi (Japan)), Takashi Nishida(Hitachi (Japan))
Unknown
January 1, 1993
Cited by 27

Abstract

The authors describe 256-Mb DRAM (dynamic random access memory) technologies for file applications. A subthreshold-current limiting scheme for word drivers is shown. The scheme uses a pMOS switching transistor between the wordline voltage and the driver transistor common-source terminal. The subthreshold current of a 256-Mb DRAM is reduced to 3% by applying this scheme to word drivers and decoders, and the total data-retention current is less than that of a 64-Mb DRAM. A redundancy technique is shown which features subarray-by-subarray replacement instead of the conventional line-by-line replacement. To evaluate the circuit technologies described here, an experimental 256-Mb DRAM was fabricated using 0.25- mu m CMOS technology with phase-shift lithography. It uses a 0.72- mu m/sup 2/ RSTC cell with a storage capacitance of 25 fF and operates on a voltage of 1.5-3.6 V.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>


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