Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives
Haoyi Wu(Guangdong University of Technology), C.P. Wong(Georgia Institute of Technology), Wei Lin(Sichuan University), Feiyu Kang(Tsinghua–Berkeley Shenzhen Institute), Xiaoya Cui(China University of Geosciences (Beijing)), Zhuo Li(Georgia Institute of Technology), Cheng Yang(University Town of Shenzhen), Jinping Liu(Wuhan University of Technology), Sum Wai Chiang(University Town of Shenzhen)
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