Fabrication of photonic crystals by deep x-ray lithography
Gregor Feiertag(Carl Zeiss (Germany)), W. Ehrfeld(Carl Zeiss (Germany)), H. Freimuth(Carl Zeiss (Germany)), Harald Kölle(Carl Zeiss (Germany)), H. Lehr(Carl Zeiss (Germany)), M. Schmidt(Carl Zeiss (Germany)), M. M. Sigalas(Iowa State University), C. M. Soukoulis(Iowa State University), G. Kiriakidis(Foundation for Research and Technology Hellas), Thomas Garm Pedersen(Foundation for Research and Technology Hellas), J. Kühl(Max Planck Society), Wolfgang Köenig(Max Planck Society)
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Abstract
We have developed a new microfabrication technique for the construction of three-dimensional photonic crystals. In particular, we used multiple tilted x-ray lithography exposures in order to construct structures with photonic band gaps in the infrared region. First polymethylmethacrylate (PMMA) resist layers with a thickness of 500 μm were irradiated, then the holes in the resist structure were filled with preceramic polymer and subsequent pyrolysis converts the preceramic polymer into a SiCN ceramic. Theoretical results with fitted values of the dielectric constant are in good agreement with the transmission measurements.
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