High-quality Ge epilayers on Si with low threading-dislocation densities
Hsin-Chiao Luan(Massachusetts Institute of Technology), Desmond R. Lim(Massachusetts Institute of Technology), Kevin C. Lee(Massachusetts Institute of Technology), Kevin Chen(Massachusetts Institute of Technology), Jessica Sandland(Massachusetts Institute of Technology), Kazumi Wada(Massachusetts Institute of Technology), Lionel C. Kimerling(Massachusetts Institute of Technology)
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Abstract
High-quality Ge epilayers on Si with low threading-dislocation densities were achieved by a two-step ultrahigh vacuum/chemical-vapor-deposition process followed by cyclic thermal annealing. On large Si wafers, Ge on Si with threading-dislocation density of 2.3×107 cm−2 was obtained. Combining selective area growth with cyclic thermal annealing produced an average threading-dislocation density of 2.3×106 cm−2.We also demonstrated small mesas of Ge on Si with no threading dislocations. The process described in this letter for making high-quality Ge on Si is uncomplicated and can be easily integrated with standard Si processes.
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