A Thermally Re-mendable Cross-Linked Polymeric Material

Xiangxu Chen, Matheus A. Dam, Kanji Ono(Division of Materials Science and Engineering), Ajit Mal(University of California, Los Angeles), Hongbin Shen(University of Southern California), Steven Nutt(University of Southern California), Kevin Sheran, Fred Wudl
Science
March 1, 2002
Cited by 2,577

Abstract

We have developed a transparent organic polymeric material that can repeatedly mend or "re-mend" itself under mild conditions. The material is a tough solid at room temperature and below with mechanical properties equaling those of commercial epoxy resins. At temperatures above 120 degrees C, approximately 30% (as determined by solid-state nuclear magnetic resonance spectroscopy) of "intermonomer" linkages disconnect but then reconnect upon cooling, This process is fully reversible and can be used to restore a fractured part of the polymer multiple times, and it does not require additional ingredients such as a catalyst, additional monomer, or special surface treatment of the fractured interface.


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