Fracture behavior of PBX simulation subject to combined thermal and mechanical loads

Zhanwei Liu(Beijing Institute of Technology), Fenglei Huang(Beijing Institute of Technology), Pengwan Chen(Beijing Institute of Technology), Ke‐meng Li(Beijing Institute of Technology), Huimin Xie(Tsinghua University)
Polymer Testing
May 28, 2009
10.1016/j.polymertesting.2009.05.011
Cited by 78

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