A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
F. Boeuf(STMicroelectronics (France)), S. Crémer(STMicroelectronics (France)), Nathalie Vulliet(STMicroelectronics (France)), Thierry Pinguet, Attila Mekis, G. Masini, Lieven Verslegers, Peng Sun, Ali Ayazi, N.-K. Hon, Subal Sahni, Y. Chi, B. Orlando(STMicroelectronics (France)), D. Ristoiu(STMicroelectronics (France)), A. Farcy(STMicroelectronics (France)), F. Leverd(STMicroelectronics (France)), Lucile Broussous(STMicroelectronics (France)), D. Pelissier-Tanon(STMicroelectronics (France)), C. Richard(STMicroelectronics (France)), L. Pinzelli(STMicroelectronics (France)), R. Beneyton(STMicroelectronics (France)), Olivier Gourhant(STMicroelectronics (France)), E. Gourvest(STMicroelectronics (France)), Y. Le-Friec(STMicroelectronics (France)), D. Monnier(STMicroelectronics (France)), P. Brun(STMicroelectronics (France)), M. Guillermet(STMicroelectronics (France)), Daniel L. Benoit(STMicroelectronics (France)), K. Haxaire(STMicroelectronics (France)), Jean–Robert Manouvrier(STMicroelectronics (France)), S. Jan(STMicroelectronics (France)), H. Petiton(STMicroelectronics (France)), J.F. Carpentier(STMicroelectronics (France)), Thomas Quémerais(STMicroelectronics (France)), C. Durand(STMicroelectronics (France)), D. Gloria(STMicroelectronics (France)), Mickael Fourel(STMicroelectronics (France)), Frederic Battegay(STMicroelectronics (France)), Y. Sanchez(STMicroelectronics (France)), E. Batail(STMicroelectronics (France)), F. Baron(STMicroelectronics (France)), P. Delpech(STMicroelectronics (France)), L. Salager(STMicroelectronics (France)), Peter De Dobbelaere, B. Sautreuil(STMicroelectronics (France))
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Abstract
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.
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