Focused, Nanoscale Electron-Beam-Induced Deposition and Etching

Steven Randolph(University of Tennessee at Knoxville), Jason D. Fowlkes(University of Tennessee at Knoxville), Philip D. Rack(Oak Ridge National Laboratory)
Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences
September 1, 2006
Cited by 414

Abstract

Focused electron-beam-induced (FEB-induced) deposition and etching are versatile, direct-write nanofabrication schemes that allow for selective deposition or removal of a variety of materials. Fundamentally, these processes are governed by an electron-induced reaction with a precursor vapor, which may either result in decomposition to a solid deposit or formation of a volatile etch by-product. The ability to induce such localized reactions by placement of a nanometer-sized focused electron probe has recently drawn considerable attention. In response, we have reviewed much of the relevant literature pertaining to both focused electron-beam-induced etching and deposition. Because these nanoscale processing techniques are still in their relative infancy, a significant amount of scientific research is being conducted to understand, and hence improve, the processes. This article summarizes the associated physics of electron-solid-vapor interactions, discusses related physical processes, and provides an introduction to electron-beam-induced etching (EBIE) and electron-beam-induced deposition (EBID). Additionally, specific applications of FEB-induced processes are discussed and several FEB computer model and simulation results are reviewed.


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