Development of SiC–SiC joint by reaction bonding method using SiC/C tapes as the interlayer
Zhaohua Luo(Chinese Academy of Sciences), Qing Huang(Chinese Academy of Sciences), Dongliang Jiang(Anhui University of Science and Technology), Qingling Lin(Chinese Academy of Sciences), Jingxian Zhang(Chinese Academy of Sciences), Zhongming Chen(South China Agricultural University)
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