Thermal characterization of power devices by scanning thermal microscopy techniques

G.B.M. Fiege(University of Wuppertal), L.J. Balk(Leibniz University Hannover), R. Barthelmeß, H.‐J. Schulze(Siemens (Germany)), F.‐J. Niedernostheide(Siemens (Germany))
Microelectronics Reliability
June 1, 1999
Cited by 18


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