Thermal characterization of power devices by scanning thermal microscopy techniques
G.B.M. Fiege(University of Wuppertal), L.J. Balk(Institut für Arbeitsmedizin, Sicherheitstechnik und Ergonomie), R. Barthelmeß, H.‐J. Schulze(Siemens (Germany)), F.‐J. Niedernostheide(Siemens (Germany))
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