Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

Ting Cheng(Huazhong University of Science and Technology), Sheng Liu(Wuhan University), Xiaobing Luo(Zhejiang Sci-Tech University), Suyi Huang(Huazhong University of Science and Technology)
International Journal of Thermal Sciences
August 3, 2009
10.1016/j.ijthermalsci.2009.07.010
Cited by 157

Related Papers

Emerging Materials and Strategies for Personal Thermal Management
|Advanced Energy Materials|2020|616
Heat and fluid flow in high-power LED packaging and applications
|Progress in Energy and Combustion Science|2016|453
Thermal Conductivity of Polymer-Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets
|ACS Applied Materials & Interfaces|2015|442
Thermal camouflaging metamaterials
|Materials Today|2021|324
LED Packaging for Lighting Applications
|Unknown|2011|301