S

Shengde Zhang

China Academy of Engineering Physics

ORCID: 0000-0002-5953-2998

Publishes on High Temperature Alloys and Creep, Fatigue and fracture mechanics, High-Temperature Coating Behaviors. 92 papers and 1.6k citations.

92Publications
1.6kTotal Citations

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Top publicationsby citations

Catalytic Steam Reforming of Fast Pyrolysis Bio‐Oil in Fixed Bed and Fluidized Bed Reactors
P. Lan, Qin Xu, Min Zhou et al.|Chemical Engineering & Technology|2010
Cited by 78Open Access

Abstract Catalytic steam reforming of bio‐oil is an economically‐feasible route which produces renewable hydrogen. The Ni/MgO‐La 2 O 3 ‐Al 2 O 3 catalyst was prepared with Ni as active agent, Al 2 O 3 as support, and MgO and La 2 O 3 as promoters. The experiments were conducted in fixed bed and fluidized bed reactors, respectively. Temperature, steam‐to‐carbon mole ratio ( S / C ), and liquid hourly space velocity (LHSV) were investigated with hydrogen yield as index. For the fluidized bed reactor, maximum hydrogen yield was obtained under temperatures 700–800 °C, S / C 15–20, LHSV 0.5–1.0 h –1 , and the maximum H 2 yield was 75.88 %. The carbon deposition content obtained from the fluidized bed was lower than that from the fixed bed. The maximum H 2 yield obtained in the fluidized bed was 7 % higher than that of the fixed bed. The carbon deposition contents obtained from the fluidized bed was lower than that of the fixed bed at the same reaction temperature.

Mechanical Properties of Copper Thin Films Used in Electronic Devices
Shengde Zhang, Masao Sakane, Takeshi Nagasawa et al.|Procedia Engineering|2011
Cited by 68Open Access

Abstract This paper presents tensile and low cycle fatigue properties of copper thin films used in electronic devices. Copper films tested were rolled copper, electrolytic copper, direct current plated copper and pulse plated copper films. Tensile tests and strain controlled 4-point bending low cycle fatigue tests were carried out and cycles to crack initiation and those for propagation were obtained. The direct current plated copper showed the largest Young's modulus among the copper films. The electronic copper showed the largest yield stress and ultimate tensile strength, and the pulse plated copper the largest elongation. The strongest resistance to crack initiation was found in the rolled copper but there was no large difference in the cracking resistance among the other copper films. Cracks of the direct current and pulse plated coppers propagated faster than those of the other copper films.